Abstract
Ultra thin (similar to 6-7nm) silicon-oxynitride films have been deposited on Strained-Si/Si0.8Ge0.2 layers M high temperature of 900 degrees C and 1000 degrees C using rapid thermal nitridation in O-2+N-2 ambient. The border trap (Q(bt)) generation using the hysteresis in high-frequency capacitance-voltage (C-NI) characteristics under both constant current stressing (CCS) and constant voltage stressing (CVS) has been analyzed. It has been observed that the interface trap charge density (D-it) and hysteresis decrease in 1000 degrees C RTN. It is also observed that the charge trapping behavior and the amount of border trap charge density are found to be low in the case of 1000 degrees C RTN process.