Abstract
Wide Bandgap (WBG) semiconductor devices are becoming the simpler and cheaper option as compared to the limited capabilities of Si devices because of their better blocking voltages, switching frequencies, thermal conductivities and operating temperatures. WBG semiconductors like Gallium Nitride (GaN) have better materials properties specifically suited for high power and high frequency electronics and they are slowly being favored for such applications. GaN High Electron Mobility Transistors (HEMTs) have demonstrated superior performance characteristics as compared to Si Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) in terms of switching characteristics and switching losses. One particular GaN HEMT module investigated by the authors has been calculated to have less than five times the switching losses as compared to a similar Si MOSFET module under the same operating conditions. The use of the GaN module instead of Si module in an inverter application has also shown reduction of power losses and heatsink volume by 60% and 30% respectively for the GaN module. This paper investigates the effect of different heatsink materials (Aluminum, Copper, AlSiC and E-Material) on the overall temperature profile of the GaN module. The heatsink structure used for the simulations were obtained from commercially available straight-fin heatsink designs. Comparisons among these heatsink materials were done for the same operating and ambient conditions by simulating the combined HEMT-Heatsink structure in the Finite Element Analysis (FEA) software COMSOL Multiphysics. The simulation results indicated Copper to be the best heatsink material among the four materials tested.