Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

Conference proceeding

Peer reviewed

S Chada, R. A Fournelle, W Laub and D Shangguan

Journal of electronic materials, Vol.29(10), pp.1214-1221

Special Issue on Packaging and Soldering Technologies for Electronic Interconnects

01/10/2000

Abstract

Applied sciences

Electronics

Exact sciences and technology

Materials

1 Record Views

Title: Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure
Creators - without role: S Chada - Marquette University
R. A Fournelle - Marquette University
W Laub - Marquette University
D Shangguan - Visteon
Publication Details: Journal of electronic materials, Vol.29(10), pp.1214-1221
Conference: Special Issue on Packaging and Soldering Technologies for Electronic Interconnects
Publisher: Institute of Electrical and Electronics Engineers
Identifiers: 9952957508331
Academic Unit: King Saud University
Language: English
Resource Type: Conference proceeding