Abstract
Conference Title: 2015 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP) Conference Start Date: 2015, Oct. 18 Conference End Date: 2015, Oct. 21 Conference Location: Ann Arbor, MI, USA Number of polymers can be reinforced by layered silicate fillers leading to polymeric nanocomposites with often superior breakdown strength and endurance and always higher dielectric losses. Investigations on the dielectric properties of PE/Clay nanocomposites have been reported several times and have shown a complex dielectric response closely related to the composite microstructure and its chemical composition. This paper presents the microstructure and the dielectric response of highly loaded HDPE/clay composites with and without a polyolefin-based compatibilizer. The influence of moisture absorption on the dielectric response was also investigated and presented.