EXPERIMENTAL BACKGROUND FOR FINITE-ELEMENT ANALYSIS OF THE INTERPLY-SLIP PROCESS DURING THERMOFORMING OF THERMOPLASTIC COMPOSITES

Conference proceeding

R Scherer and K Friedrich

DEVELOPMENTS IN THE SCIENCE AND TECHNOLOGY OF COMPOSITE MATERIALS, pp.1001-1006

01/01/1990

Abstract

Engineering

Engineering, Multidisciplinary

Materials Science

Materials Science, Multidisciplinary

Science & Technology

Technology

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Title: EXPERIMENTAL BACKGROUND FOR FINITE-ELEMENT ANALYSIS OF THE INTERPLY-SLIP PROCESS DURING THERMOFORMING OF THERMOPLASTIC COMPOSITES
Creators - without role: R Scherer
K Friedrich
Contributors - without role: J Fuller
G Grunninger
K Schulte
A R Bunsell
A Massiah
Publication Details: DEVELOPMENTS IN THE SCIENCE AND TECHNOLOGY OF COMPOSITE MATERIALS, pp.1001-1006
Publisher: Elsevier
Number of pages: 6
Identifiers: 9951710008331
Academic Unit: King Saud University
Language: English
Resource Type: Conference proceeding