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Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics
Conference proceeding   Open access

Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics

Y. Al-Anii, A. Almaneea, N. Kapur, J. Summers and H. Thompson
HEAT TRANSFER XIV: SIMULATION AND EXPERIMENTS IN HEAT TRANSFER AND ITS APPLICATIONS, Vol.106, pp.127-138
WIT Transactions on Engineering Sciences
01/01/2016

Abstract

Engineering Engineering, Mechanical Mechanics Physical Sciences Science & Technology Technology Thermodynamics
url
https://doi.org/10.2495/HT160131View
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