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Electrical assessment of planarisation for CMP [inter-layer dielectrics]
Conference proceeding

Electrical assessment of planarisation for CMP [inter-layer dielectrics]

J.P. Elliott, M. Fallon, A.J. Walton, J.T.M. Stevenson, A. O'Hara, A. Shaffi, C.M. Reeves and IEEE
1997 IEEE International Conference on Microelectronic Test Structures Proceedings, pp.85-90
1997

Abstract

Buildings Capacitance Dielectric measurements Electric variables measurement Integrated circuit interconnections Planarization Robustness Surfaces Teeth Testing

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