Abstract
The RF wireless interconnects are presented as an alternative solution to intra-chip clock distribution, which leads to sever power consumption and signal integrity limitations for over GHz digital applications. In this work, this concept is implemented in MCM package and board levels to meet the high-speed transmission performance. Miniaturized dipole antennas printed on high-K substrate are used and a good transmission gain is obtained for a separation distance of from 1 cm to 4 cm. In this paper we focus our study in the analysis of the interferences generated by antennas used in the RF-wireless clock distribution. The parasitic coupling between antennas and multilayer interconnects is discussed for different configurations.