Abstract
We use two examples to show how transients are used to improve copper deposition profiles in features during electrochemical deposition processes; 1) pulsed potential electroplating, and 2) constant potential electroplating in systems with an accumulating surface species that acts as a deposition accelerator. A finite element based method is presented to track the species concentrations in the fluid phase, and surface coverages as functions of time. To help demonstrate the effects of the transients, feature profiles are presented for simulations both with and without transient behavior. The need to account for transient behavior is highlighted.