Abstract
We demonstrate for the first time a gate first high-k/metal gate (MG) nFET with EOT=0.74nm (T-inv=1.15mn), low V-t =0.30V, high performance [I-on/I-off=1310(mu A/um) at 100(nA/um)], low leakage (> 200x reduction vs. SiO2/PolySi) and good PBTI. Low-k interface layer scaling and high-k La-doping enable this desirable EOT and V-t. SiON/HfLaSiON can give similar interface quality as SiO2/HfSiON. Device performance was further improved 5% by strain engineering.