Abstract
Hierarchical interconnection networks (HINs) employ multiple levels in which Lower-level networks provide local communication while higher-level networks facilitate remote communication. HINs are cost effectiveness and fault-tolerant. They can be classified into two classes. The first class includes HINs that are constructed using nodes and/or links replication. The second class uses standby interface nodes. This paper provides performance comparison of HINs in terms of network degree, diameter, cost and packing density. The outcome of this study shows that the Root-Folded Heawood (RFH) and the Flooded Heawood (FloH) provide the best network cost, defined as the product of network diameter and degree. The study also shows that HFCube(n, n) provide the best packing density, i.e. the smallest chip area required for VLSI implementation.