Potential influence on copper electrodeposition on scratched silicon surfaces

Conference proceeding

Peer reviewed

Y Zhang, E Balaur and P Schmuki

Journal of electroceramics, Vol.16(1), pp.65-70

Summer school on electrochemistry and nanotechnology

01/02/2006

Abstract

Applied sciences

Electronics

Exact sciences and technology

General (including economical and industrial fields)

1 Record Views

Title: Potential influence on copper electrodeposition on scratched silicon surfaces
Creators - without role: Y Zhang - Friedrich-Alexander-Universität Erlangen-Nürnberg
E Balaur - Friedrich-Alexander-Universität Erlangen-Nürnberg
P Schmuki - Friedrich-Alexander-Universität Erlangen-Nürnberg
Publication Details: Journal of electroceramics, Vol.16(1), pp.65-70
Conference: Summer school on electrochemistry and nanotechnology
Publisher: Springer
Identifiers: 9937214508331
Academic Unit: King Abdulaziz University
Language: English
Resource Type: Conference proceeding