Abstract
Conference Title: 2018 China Semiconductor Technology International Conference (CSTIC) Conference Start Date: 2018, March 11 Conference End Date: 2018, March 12 Conference Location: Shanghai, China In this paper, extreme tiny defects are detected and monitored by using brightfiled inspection system in 28nm back-end-of-the-line (BEOL) processes. Two main defects, including tiny bridge and tiny bump defects, were studied by a novel combination of dedicated scan settings such as spectrum mode, directional electrical field (DEF), focus offset and so on. The purpose of these studies is to capture defects more efficiently. After defect detecting, failure models of these defects were established and the effective defect reduction actions were carried out. Combining effective defect monitor and defect reduction actions can make BEOL yield improve rapidly.