A hybrid 2-D ADI-FDTD subgridding scheme for modeling on-chip interconnects

Journal article

Bing-Zhong Wang, YINGJUN Wang, WENHUA YU and Raj Mittra

IEEE transactions on advanced packaging, Vol.24(4), pp.528-533

01/11/2001

Abstract

Applied sciences

Circuit properties

Electric, optical and optoelectronic circuits

Electronic equipment and fabrication. Passive components, printed wiring boards, connectics

Electronics

Exact sciences and technology

Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits

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Title: A hybrid 2-D ADI-FDTD subgridding scheme for modeling on-chip interconnects
Creators - without role: Bing-Zhong Wang - University of Electronic Science and Technology of China
YINGJUN Wang - University of Electronic Science and Technology of China
WENHUA YU - Pennsylvania State University
Raj Mittra - Pennsylvania State University
Publication Details: IEEE transactions on advanced packaging, Vol.24(4), pp.528-533
Publisher: Institute of Electrical and Electronics Engineers
Identifiers: 9934485408331
Academic Unit: King Abdulaziz University
Language: English
Resource Type: Journal article