Abstract
The purpose of this paper is to assess thermal management and optimization of several parameters such as: materials, size and thickness of all subcomponents of single-chip Light Emitting Diode (LED) in order to minimize its junction temperature and thereby maximizing light output and device reliability.
For this, we developed a three-dimensional code using Comsol Multiphysics that solves the systems of equations for the mass, momentum and energy. After validation of this numerical 3D code, the thermal Characterization of Subcomponents of LED system is studied numerically. This system is divided into 6 parts such as: metallization, die, die-attach, substrate, Thermal Interface Material and heat sink. Several materials which can be used in each part of the LED package from metallization to the heat sink are studied. By moving to one part to another, it was selected the best materials always allowing a minimum junction temperature.