Abstract
Purpose The purpose of this paper is to optimize the configuration of a heat sink with phase change material for improving the cooling performance of light emitting diodes (LED). Design/methodology/approach A numerical three-dimensional time-dependent model is developed with COMSOL Multiphysics to simulate the phase change material melting process during both the charging and discharging period. Findings The model is validated with previously published works. It found a good agreement. The difference between filled cavities with phase change materials (PCM) and alternate cavities air-PCM is discussed. The last-mentioned showed a good ability for reducing the junction temperature during the melting time. Three cases of this configuration having the same total volume of PCM but a different number of cavities are compared. The case of ten fins with five PCM cavities is preferred because it permit a reduction of 21 per cent of the junction temperature with an enhancement ratio of 2:4. The performance of this case under different power input is verified. Originality/value The use of alternate air-PCM cavities of the heat sink. The use of PCM in LED to delay the peak temperature in the case of thermal shock (for example, damage of fan) An amount of energy is stored in the LED and it is evacuated to the ambient of the accommodation by the cycle of charging and discharging established (1,765 Joule stored and released each 13 min with 1 LED chip of 5 W).