Abstract
The present article reports on a detailed experimental investigation of using carbon foam–PCM–MWCNTs composite materials for thermal management (TM) of electronic devices subjected to pulsed power. The TM module was fabricated by infiltrating paraffin wax (RT65) as a phase change material (PCM) and multi walled carbon nanotubes (MWCNTs) as a thermal conductivity enhancer in a carbon foam as a base structure. Two carbon foam materials of low and high values of thermal conductivities, CF20 and KL1-250 (3.1 and 40 W/m K), were tested as a base structure for the TM modules. Tests were conducted at different power intensities and power cycling/loading modes. Results showed that for all power varying modes and all carbon foams, the infiltration of RT65 into carbon foam reduces the temperature of TM module and results in damping the temperature spikes height. Infiltration of MWCNTS into RT65 further improves the effectiveness of TM module. Temperature damping was more pronounced in stand-alone pulsed power cycles as compared to pulsed power spikes modes. The effectiveness of inclusion of RT65 and RT65/MWCNTs in damping the temperature spikes height is remarkable in TM modules based on KL1-250 as compared to CF-20.