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As Migration during PtSi Formation
Journal article   Peer reviewed

As Migration during PtSi Formation

A. H. Hamdi, F. D. McDaniel and S. R. Wilson
IEEE transactions on nuclear science, Vol.30(2), pp.1738-1740
04/1983

Abstract

Annealing Atmosphere Atomic layer deposition Backscatter Etching Magnetic analysis Physics Silicides Silicon Temperature
The migration of implanted As durinq PtSi formation on (100) Si wafers has been studied by Rutherford backscattering techniques. Two thicknesses of PtSi layer (50 and 200 nm) have been choosen for this study. The PtSi formation temperatures were either 525°C or 625°C. The data show that the number of the migrating As atoms is independent of the PtSi thickness or formation temperatures used in this investigation.

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