Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Journal article

Peer reviewed

Shi-Wei Ricky Lee, BEN HOI WAI Lui, Y. H Kong, Bernard Baylon, Timothy Leung, Pomoeo Umali and Hector Agtarap

Soldering & surface mount technology, Vol.14(3), pp.46-50

01/01/2002

Abstract

Applied sciences

Electronic equipment and fabrication. Passive components, printed wiring boards, connectics

Electronics

Exact sciences and technology

Materials

Microelectronic fabrication (materials and surfaces technology)

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

Testing, measurement, noise and reliability

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Title: Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Creators - without role: Shi-Wei Ricky Lee - Hong Kong University of Science and Technology
BEN HOI WAI Lui - University of Hong Kong
Y. H Kong - Advanced Interconnect Technologies
Bernard Baylon - Advanced Interconnect Technologies
Timothy Leung - Advanced Interconnect Technologies
Pomoeo Umali - Advanced Interconnect Technologies
Hector Agtarap - Advanced Interconnect Technologies
Publication Details: Soldering & surface mount technology, Vol.14(3), pp.46-50
Publisher: Emerald
Identifiers: 9921589208331
Language: English
Resource Type: Journal article