Abstract
In continuation to our earlier work on nickel (Ni)-arsenate (As) composite, the current work deals with the electrical conductivity and mechanical resistivity of the same composite by means of its further reinforcement with the polylactic acid (PLA) polymer. For the PLA-Ni-As composite, we understand from the electrochemical studies that the conductivity is strongly influenced by the temperature and due to the presence of external electrolyte. The DC electrical conductivity approach used for the temperature dependency provided the information that the conductivity falls in the semiconductor zone ranging at 10−3 S cm−1, thereby indicating that it followed the Arrhenius equation. In addition, we found in terms of the mechanical properties that the PLA-Ni-As composite outperformed the plain, untreated Ni-As composite by reducing the activation energy. For the mechanical resistivity studies we found that the 25% PLA-loaded Ni-As material significantly improved the tensile strength and modulus, elongation at break %, impact properties and also the flexural strength and modulus as against the plain and other combinations due to enhanced interfacial interactions. The cell viability and proliferations studies tested against two different cell lines provided the information that the presence of polymer reduces the toxic response of arsenic material. From the cumulative analysis therefore, we indicate that the PLA-Ni-As composite can be a potential candidate to find its uses in the electrochemical and solar cells, in addition to automotive and aerospace industry.
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•Described the ways of improving inbuilt properties of Ni-As composite by the reinforcement of PLA polymer,•Significant enhancement in the composite’s electrical conductivity by the electrolyte and even at higher temperatures,•Improved the dynamic mechanical properties of PLA-Ni-As due to PLA loading and its effective bonding with Ni-As particles,•Found the means of utilizing the features of As while concurrently shielding it from releasing into the environment.