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Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method
Journal article   Peer reviewed

Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Xuan Zhang, Xiujun Zheng, Hong Zhang, Junli Zhang, Jiecai Fu, Qiang Zhang, Chaoyi Peng, Feiming Bai, Xixiang Zhang and Yong Peng
Journal of materials chemistry. C, Materials for optical and electronic devices, Vol.5(34), pp.8707-8713
2017
DOI: https://doi.org/10.1039/c7tc01668a

Abstract

Materials Science Materials Science, Multidisciplinary Physical Sciences Physics Physics, Applied Science & Technology Technology
Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

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