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Change of microstructure of polyimide thin films under the action of supercritical carbon dioxide and its influence on dielectric constant
Journal article   Peer reviewed

Change of microstructure of polyimide thin films under the action of supercritical carbon dioxide and its influence on dielectric constant

I. A. Ronova, M. Bruma, O. V. Sinitsyna, I. Sava, A. Yu Nikolaev, S. Chisca and N. G. Ryvkina
Structural chemistry, Vol.25(6), pp.1687-1694
01/12/2014

Abstract

Chemistry Chemistry, Multidisciplinary Chemistry, Physical Crystallography Physical Sciences Science & Technology
A series of polyimide films, whose repeating units had different contents of fluorine atoms in the structure, was subjected to swelling in supercritical carbon dioxide. The greatest increase in the free volume was 257 % of the initial value. This led to the formation of foams and reduction of the dielectric constant even below 1.5.

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