Chemical vapour deposition of thin copper films using a new metalorganic precursor

Journal article

Peer reviewed

J Goswami, L Raghunathan, A Devi, S. A Shivashankar and S Chandrasekaran

Journal of materials science letters, Vol.15(7), pp.573-575

01/04/1996

Abstract

Applied sciences

Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)

Cross-disciplinary physics: materials science; rheology

Exact sciences and technology

Materials science

Metals. Metallurgy

Methods of deposition of films and coatings; film growth and epitaxy

Physics

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Title: Chemical vapour deposition of thin copper films using a new metalorganic precursor
Creators - without role: J Goswami - Indian Institute of Science Bangalore
L Raghunathan - Indian Institute of Science Bangalore
A Devi - Indian Institute of Science Bangalore
S. A Shivashankar - Indian Institute of Science Bangalore
S Chandrasekaran - Indian Institute of Science Bangalore
Publication Details: Journal of materials science letters, Vol.15(7), pp.573-575
Publisher: Kluwer Academic Publishers
Identifiers: 9936250008331
Academic Unit: King Abdulaziz University
Language: English
Resource Type: Journal article