Comparison of Uniaxial Wafer Bending and Contact-Etch-Stop-Liner Stress Induced Performance Enhancement on Double-Gate FinFETs

Journal article

Peer reviewed

Sagar Suthram, M. M. Hussain, H. R. Harris, C. Smith, H.-H. Tseng, R. Jammy and S. E. Thompson

IEEE electron device letters, Vol.29(5), pp.480-482

01/05/2008

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Title: Comparison of Uniaxial Wafer Bending and Contact-Etch-Stop-Liner Stress Induced Performance Enhancement on Double-Gate FinFETs
Creators - without role: Sagar Suthram - University of Florida
M. M. Hussain
H. R. Harris
C. Smith
H.-H. Tseng
R. Jammy
S. E. Thompson - University of Florida
Publication Details: IEEE electron device letters, Vol.29(5), pp.480-482
Identifiers: 9942020408331
Academic Unit: King Saud University
Language: English
Resource Type: Journal article