Abstract
Phase change materials (PCMs) are ideal for thermal management in miniaturized and integrated electronic devices. However, developing PCMs with efficient thermal management and electromagnetic interference (EMI) shielding has remained a challenge to keep up with the rapid evolution of precision electronics. Herein, melamine foam (MF) was used as a template to build a continuous thermal/conductive network by dip-coating magnetized nickel (Ni)/MXene (NiM), and then, polyethylene glycol (PEG) was encapsulated into porous NiM/MF hybrid sponge via vacuum impregnation method. With the synergistic effect of magnetic Ni chain and highly conductive MXene, the obtained NiM/PCM achieve suitable thermal conductivity (0.39 W/mk), high electrical conductivity (76.3 S/m), and excellent EMI shielding effectiveness (34.6 dB). In addition, the NiM/PCM endows outstanding thermal stability, durability, and high latent heat storage capabilities. This work provides new ideas and insights for the EMI shielding and temperature protection of future microelectronic devices.