Abstract
Swift cooling systems, improved microprocessor chips, processors' performance and power usage have increased production of an enormous amount of heat and high operating temperatures due to excess heat flux density in the field of microelectronics. A rapid cooling of electronic circuits and heat dissipation for the same size of pipe with the present technology as nano size circuits critically generate high heat flux beyond 100 W/cm(2) is currently the challenging task with which we are presented. Cooling in the form of heat transfer should be managed using both thermal conductivity (evaporation) and phase transition (condensation) between the two solid interfaces due to the higher amount of heat fluxes, high heat carrying capacity in a smaller size of heat exchangers as well as the heat pipe. A comprehensive knowledge of this mechanism is vet to be achieved, despite the fact that a heat pipe operates against gravity and a high heat carrier capability. In this article, a detailed study of the performance of a heat pipe (temperature gain and heat transfer capability) under the influence of various working parameters such as working fluid, a wick structure, thermal properties, heat input and applications of the field is carried out in order to increase the cooling capability of the heat pipe. Also, the optimum level of various working parameters on the thermal performance of a heat pipe using a Taguchi-Grey - analysis has been presented followed by ANOVA and confirmation tests.