Different behavior in immersion plating of nickel on porous silicon from acidic and alkaline fluoride media

Journal article

Peer reviewed

Farid A Harraz, Junji Sasano, Tetsuo Sakka and Yukio H Ogata

Journal of the Electrochemical Society, Vol.150(5), pp.C277-C284

01/05/2003

Abstract

Cross-disciplinary physics: materials science; rheology

Electrodeposition, electroplating

Exact sciences and technology

Materials science

Methods of deposition of films and coatings; film growth and epitaxy

Physics

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Title: Different behavior in immersion plating of nickel on porous silicon from acidic and alkaline fluoride media
Creators - without role: Farid A Harraz - Kyoto University
Junji Sasano - Kyoto University
Tetsuo Sakka - Kyoto University
Yukio H Ogata - Kyoto University
Publication Details: Journal of the Electrochemical Society, Vol.150(5), pp.C277-C284
Publisher: Electrochemical Society
Identifiers: 9924877108331
Academic Unit: Najran University
Language: English
Resource Type: Journal article