Abstract
Al
dispersion-strengthened (ODS) copper has an excellent comprehensive performance due to the strong hindrance of the high concentration nano-Al
to the dislocations inside copper grains. However, the processability of ODS copper is seriously deteriorated, which is caused by the presence of unfavorable microlevel Al
particles along powder particle boundaries. In this study, a strategy of ball-milling-induced impurity removal is adopted to surmount the dilemma. It was found that the ball milling process can significantly weaken the formation of large Al
particles in the primary boundaries. However, due to the activation of the powder particle surface, the metallurgical bonding between the powder particles is strengthened. The results showed that the ball-milled samples exhibited the optimal properties, including the ultimate tensile strength of 488 ± 3 MPa, elongation of 18.7 ± 0.7%, reduction in the area of 46.8 ± 1.2%, 82.2 ± 0.3 Rockwell Hardness measured on the B scale (HRB), and electrical conductivity of 77.2 ± 0.1% International Association of Classification Societies (IACS).