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Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits
Journal article   Peer reviewed

Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

Lei Wang, Manxiang Wang, Jinrong Lu, Ryanda Enggar Anugrah Ardhi, Jing Liu, Guicheng Liu and Joong Kee Lee
Journal of the Taiwan Institute of Chemical Engineers, Vol.95, pp.202-207
02/2019

Abstract

Direct writing Liquid metal Printed electronics Printer paper Wetting processing

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