Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques

Journal article

Peer reviewed

Arthur Nieuwoudt and Yehia Massoud

IEEE transactions on electron devices, Vol.53(10), pp.2460-2466

01/10/2006

Abstract

Applied sciences

Design. Technologies. Operation analysis. Testing

Electronics

Exact sciences and technology

Integrated circuits

Interfaces

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

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Title: Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques
Creators - without role: Arthur Nieuwoudt - Rice University
Yehia Massoud - Rice University
Publication Details: IEEE transactions on electron devices, Vol.53(10), pp.2460-2466
Publisher: Institute of Electrical and Electronics Engineers
Identifiers: 9942784308331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article