Fabrication of undoped semi-insulating InP by multiple-step wafer annealing

Journal article

Peer reviewed

M Uchida, K Kainosho, M Ohta and O Oda

Journal of electronic materials, Vol.27(1), pp.8-11

01/01/1998

Abstract

Applied sciences

Cold working, work hardening; annealing, post-deformation annealing, quenching, tempering recovery, and crystallization

Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures

Cross-disciplinary physics: materials science; rheology

Electronics

Exact sciences and technology

Materials science

Microelectronic fabrication (materials and surfaces technology)

Physics

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

Treatment of materials and its effects on microstructure and properties

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Title: Fabrication of undoped semi-insulating InP by multiple-step wafer annealing
Creators - without role: M Uchida - Japan Petroleum Energy Center
K Kainosho - Japan Petroleum Energy Center
M Ohta - Japan Petroleum Energy Center
O Oda - Japan Petroleum Energy Center
Publication Details: Journal of electronic materials, Vol.27(1), pp.8-11
Publisher: Institute of Electrical and Electronics Engineers
Identifiers: 9921683108331
Academic Unit: King Saud Bin Abdulaziz University for Health Sciences
Language: English
Resource Type: Journal article