Feature superfilling in copper electrochemical deposition

Journal article

Peer reviewed

S Soukane, S Sen and And T. S Cale

Journal of the Electrochemical Society, Vol.149(1), pp.C74-C81

2002

Abstract

Applied sciences

Electronics

Exact sciences and technology

Lithography, masks and pattern transfer

Microelectronic fabrication (materials and surfaces technology)

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

1 Record Views

Title: Feature superfilling in copper electrochemical deposition
Creators - without role: S Soukane - Rensselaer Polytechnic Institute
S Sen - Rensselaer Polytechnic Institute
And T. S Cale - Rensselaer Polytechnic Institute
Publication Details: Journal of the Electrochemical Society, Vol.149(1), pp.C74-C81
Publisher: Electrochemical Society
Identifiers: 9941660008331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article