Flow Induced Deflection and Stress on Flexible Printed Circuit Board in Fan-Cooled Electronic Systems: FSI Approach

Journal article

Peer reviewed

Wei Chiat Leong, Mohd. Zulkifly Abdullah and M. Abdul Mujeebu

IEEE transactions on components, packaging, and manufacturing technology (2011), Vol.2(4), pp.617-624

01/04/2012

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Title: Flow Induced Deflection and Stress on Flexible Printed Circuit Board in Fan-Cooled Electronic Systems: FSI Approach
Creators - without role: Wei Chiat Leong
Mohd. Zulkifly Abdullah - Universiti Sains Islam Malaysia
M. Abdul Mujeebu - Universiti Sains Islam Malaysia
Publication Details: IEEE transactions on components, packaging, and manufacturing technology (2011), Vol.2(4), pp.617-624
Identifiers: 9914950408331
Academic Unit: Imam Abdulrahman Bin Faisal University
Language: English
Resource Type: Journal article