Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

Paul R. Berger; Muhammad Mustafa Hussain; Francesca Iacopi; Jorg Schulze; Peide Ye; Willy Rachmady; Huang-Chun Wen; Siddharth Krishnan

doi:10.1109/TED.2021.3083455

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Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

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Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

Paul R. Berger, Muhammad Mustafa Hussain, Francesca Iacopi, Jorg Schulze, Peide Ye, Willy Rachmady, Huang-Chun Wen and Siddharth Krishnan

IEEE transactions on electron devices, Vol.68(7), pp.3138-3141

07/2021

DOI: https://doi.org/10.1109/TED.2021.3083455

Abstract

Graphene

Indium tin oxide

Material properties

Special issues and sections

Thermal management of electronics

Thermodynamics

Thermal budgets hinder leading-edge ultra-scaled and novel designs, and moving to reduced temperature processing is becoming an acute impediment globally.

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Title: Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices
Creators - without role: Paul R. Berger - The Ohio State University
Muhammad Mustafa Hussain - King Abdullah University of Science and Technology
Francesca Iacopi - University of Technology Sydney
Jorg Schulze - University of Stuttgart
Peide Ye - Purdue University West Lafayette
Willy Rachmady - Intel
Huang-Chun Wen - Texas Instruments
Siddharth Krishnan - Applied Materials
Publication Details: IEEE transactions on electron devices, Vol.68(7), pp.3138-3141
Publisher: IEEE
Identifiers: 9949483108331
Academic Unit: King Saud University
Language: English
Resource Type: Journal article