Abstract
The recent paper proposes a hybrid micro-grinding process for ultra-precision meso/micro components of monocrystalline silicon manufacturing. The proposed technique utilizes the chemical modification solution to modify and soften the surface layer and then manufactures meso/micro-structures via micro-grinding. A special chemical solution with optimized formula was prepared, and a 0.31 mm diameter, CVD diamond micro-grinding tool is hired to perform the micro-grinding action at 100,000 rpm of spindle speed, 0.2 mm/min of feed rate, and a machining depth of 10 µm. The results show that the proposed hybrid micro-grinding process achieves a superior machining quality compared with the conventional micro-grinding process. Moreover, the micro-grinding tool used in the proposed grinding strategy has far smaller tool wear than the conventional process.