Abstract
Thermal management of microelectronics is a challenging task in modern high heat generating devices. In this work, thermal performance of normal-channel facile heat sink has been investigated using water and TiO
2
-H
2
O (mixture of Rutile and Anatase) nanofluids with volumetric concentration of 0.005% and 0.01%. The maximum reduction in base temperature was noted for TiO
2
-H
2
O (∅ = 0.01%) and TiO
2
-H
2
O (∅ = 0.005%) as 8.2% and 5.5%, respectively, when compared with water. The thermal performance of normal-channel facile heat sink was then compared with the mini-channel integral fin heat sink. The base temperature of normal-channel facile heat sink was found very close to mini-channel integral fin heat sink with a maximum difference of 1.8%. The total cost to fabricate mini-channel heat sink was almost 5.3 times greater than normal-channel heat sink. So, the normal-channel heat sink has economical advantage over the mini-channel heat sink in terms of lower fabrication cost with similar thermal performance. However, the pressure drop was found greater for normal-channel as compared to mini-channel heat sink. The experimental results of normal-channel facile heat sink were also validated numerically, and a good agreement was found.