Immersion Plating of Copper on Porous Silicon in Various Solutions

Journal article

Y.H. Ogata, J. Sasano, J. Jorne, T. Tsuboi, F.A. Harraz and T. Sakka

Physica status solidi. A, Applied research, Vol.182(1), pp.71-77

11/2000

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Title: Immersion Plating of Copper on Porous Silicon in Various Solutions
Creators - without role: Y.H. Ogata - Kyoto University
J. Sasano - Kyoto University
J. Jorne - University of Rochester
T. Tsuboi - Niigata University
F.A. Harraz - Kyoto University
T. Sakka - Kyoto University
Publication Details: Physica status solidi. A, Applied research, Vol.182(1), pp.71-77
Publisher: WILEY-VCH Verlag Berlin GmbH
Number of pages: 7
Identifiers: 9924703208331
Academic Unit: Najran University
Language: English
Resource Type: Journal article