In-situ atomic force microscopic study of reverse pulse plated Cu/Co-Ni-Cu films

Journal article

Peer reviewed

D Gupta, A. C Nayak, J Mazher, R Sengar, K. P Joshi and R. K Pandey

Journal of materials science, Vol.39(5), pp.1615-1620

01/03/2004

Abstract

Applied sciences

Condensed matter: structure, mechanical and thermal properties

Cross-disciplinary physics: materials science; rheology

Electrodeposition, electroplating

Exact sciences and technology

Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties

Materials science

Metals. Metallurgy

Methods of deposition of films and coatings; film growth and epitaxy

Physics

Solid surfaces and solid-solid interfaces

Structure and morphology; thickness

Surface structure and topography

Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)

Thin film structure and morphology

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Title: In-situ atomic force microscopic study of reverse pulse plated Cu/Co-Ni-Cu films
Creators - without role: D Gupta - Barkatullah University
A. C Nayak - Barkatullah University
J Mazher - Barkatullah University
R Sengar - Barkatullah University
K. P Joshi - Devi Ahilya Vishwavidyalaya
R. K Pandey - Barkatullah University
Publication Details: Journal of materials science, Vol.39(5), pp.1615-1620
Publisher: Springer
Identifiers: 9919922608331
Academic Unit: King Faisal University
Language: English
Resource Type: Journal article