Abstract
Corrosion protection of copper is a major problem in the industry. Creating a grand prevention plan is a common research topic. Pharmaceutical solutions soluble Solupred compound in 1.0 M sulfamic acid solution (NH3SO3) were used to prevent copper corrosion. SEM was used to evaluate the copper plate, while mass loss testing and electrochemical testing were used to assess its effectiveness in preventing corrosion. The Cu was exposed to an acid solution containing 300 ppm of the dissolved inhibitor chemical, and electrochemical testing showed an inhibition efficiency of 95.6% and 90.1%, respectively. Because the inhibitor suppressed all of this cathodic and anodic corrosion and followed the Langmuir isotherm, it must have been classified as an inhibitor of mixed types. Scanning Electron Microscope (SEM) scans revealed a considerable improvement in the surface of copper in the presence of Solupred compared to when it was not present in sulfamic acid, confirming Solupred's efficiency in protecting copper's surface in the presence of sulfamic acid solution. Furthermore, the conclusions of the computer simulations are largely supported by these experimental results. In addition, The Molecular Dynamic simulation results helped to visualize the adsorbed structure of this compound on the surface of the Cu.
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