Abstract
The microstructure and mechanical properties of five binary pre-aged Sn-Cu alloys with varying Cu contents were investigated. The Cu compositions examined varied from 1 wt% to 5 wt%. Serial aging heat treatment processes were performed at 373, 393, 413 and 433 K with a holding time of 2 h at each temperature. The microstructural characteristics of the tested alloys have been investigated using scanning electron microscope (SEM) and X-rays diffraction (XRD). Typical indentation creep curves were derived from hardness values. The minimum creep rate is increased as the Cu content increased up to 4 wt%, but above this level the trend is reversed. Moreover, increasing aging temperature resulted in an increase in the minimum creep rate for the all tested alloys. The mean values of energy activating the creep process are in agreement with that quoted for dislocation core diffusion mechanism.
•The effect of Cu content on the microstructure and mechanical properties of Sn-Cu alloys has been studied.•The results showed that the Sn-4wt% Cu solder alloy exhibited the best creep resistance.•The values of activation energy were found to be consistent with dislocation core diffusion mechanism.