Abstract
In this study, the thermal behavior of atomic structures has been studied by examining factors as adding nanoparticles (NPs), increasing the radius of NPs and the atomic percentage of copper oxide (CuO) NPs, heat flux and temperature difference in simulated samples. First, the equilibrium of atomic samples has been examined by examining the physical quantities of total energy, potential energy, kinetic energy, and temperature. Second, to investigate thermal behavior of atomic structures, the physical quantities of the thermal conductivity coefficient (TCC) and phase change duration (PCD) were calculated. The obtained outcomes proved by adding NPs, increasing radius of NPs and their atomic percentage, the TCC increases and PCD in the structures decreases. Addition of copper oxide NPs into the basefluid leads to an increase in atomic mobility in the structure and the amount of heat transfer (HT) in the structures increases. This increase causes more oscillation range in the structures and as a result more effective HT of nanofluid as well as phase change in atomic samples. Examining the heat flux shows that its excessive increase leads to a decrease in the duration of NPs clumping.