Abstract
In this study, residual stress influences on the vibrational behavior of piezoelectric circular microdiaphragm-based biosensors are investigated theoretically and experimentally. The piezoelectric microdiaphragm was first fabricated by combining sol-gel PZT thin film and MEMS technology. The stress measurements by the wafer curvature method and the micro-Raman technique demonstrate that high tensile stresses are generated in the upper films (Pt/PZT/Pt), while the silicon oxide layer experiences a compressive stress. After backside etching of the microdiaphragm, the suspended membrane method was used to measure the average stress and equivalent Young's modulus of the diaphragm, which were 96 MPa and 106.4 GPa, respectively. The dynamic behavior of the fabricated sensor under this stress was then investigated. A comprehensive mechanics model based on vibration modes is presented and the natural frequencies of the diaphragm are obtained. A nondimensional tension parameter is defined, and effects of this parameter on the resonant frequency of the diaphragm are presented. It was concluded that both flexural rigidity and tension contribute to the resonant frequency of the diaphragm sensor. Finally, the resonant frequencies of the fabricated sensor were measured by impedance analysis and laser vibrometry techniques. These frequencies were compared with their theoretical counterparts and a good agreement was observed.