Abstract
In this paper, the numerical study of the thermal efficiency of a micro-heatsink (MHS) with nanofluid flow of water and alumina has been done. The heatsink (HS) is designed to cool an electronic component. Four different wall models have been studied in MHS. By changing the inlet velocity, the volume percentage of nanoparticles for different HS models, the values of heat transfer coefficient, thermal resistance, temperature uniformity and FOM have been studied. The equations are discretized using the volume control method, and FLUENT software is used for simulation. The results of the study demonstrated that in the case that pin fins were tangential, the lowest temperature and thermal resistance, as well as the best temperature uniformity occurred on the contact surface of the MHS and microchip. Some of the models proposed in this article had better thermal performance compared to similar HSs and could reduce the temperature of microchips to lower levels and improve the performance of electronic devices. Finally, it is suggested that the geometry of connected fin pins be used as heatsink walls.