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Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field
Journal article   Peer reviewed

Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field

A. A. Ibrahiem and A. A. El-Daly
Microelectronics and reliability, Vol.98, pp.10-18
01/07/2019

Abstract

Engineering Engineering, Electrical & Electronic Nanoscience & Nanotechnology Physical Sciences Physics Physics, Applied Science & Technology Science & Technology - Other Topics Technology

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