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Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging
Journal article   Peer reviewed

Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging

Raymond Fournelle
JOM (1989), Vol.56(6), pp.33-33
01/06/2004
DOI: https://doi.org/10.1007/s11837-004-0107-5

Abstract

Conferences Electronics industry Environmental regulations Intermetallic compounds Lead Microscopy Recycling Soldering Solidification
Continuing the trend, the recent LeadFree Solders and Processing Issues Relevant to Microelectronic Packaging symposium held in March 2004 at the TMS Annual Meeting in Charlotte, North Carolina attracted a large number of participants from the United States, Canada, Europe, and the Far East. The symposium, organized by L.J. Turbini, S. Chada, S.K. Kang, K.L. Lin, M.R. Notis, and J.

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