Abstract
At the 2003 TMS Annual Meeting in San Diego, California, a technical symposium on "Pb-Free Solders and Processing Issues Relevant to Microelectronic Packaging" (organized by J. Lucas, S. Chada, S. Kang, C. Kao, K. Lin, J. Ready, and J. Yu), sponsored by the Electronic Packaging and Interconnection Materials Committee of EMPMD, was another successful forum for presenting and discussing recent findings on various aspects of lead-free solders R&D.