Metal deposition onto a porous silicon layer by immersion plating from aqueous and nonaqueous solutions

Journal article

Peer reviewed

F. A Harraz, T Tsuboi, J Sasano, T Sakka and Y. H Ogata

Journal of the Electrochemical Society, Vol.149(9), pp.C456-C463

01/09/2002

Abstract

Cross-disciplinary physics: materials science; rheology

Electrodeposition, electroplating

Exact sciences and technology

Materials science

Methods of deposition of films and coatings; film growth and epitaxy

Physics

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Title: Metal deposition onto a porous silicon layer by immersion plating from aqueous and nonaqueous solutions
Creators - without role: F. A Harraz - Kyoto University
T Tsuboi - Kyoto University
J Sasano - Kyoto University
T Sakka - Kyoto University
Y. H Ogata - Kyoto University
Publication Details: Journal of the Electrochemical Society, Vol.149(9), pp.C456-C463
Publisher: Electrochemical Society
Identifiers: 9924679008331
Academic Unit: Najran University
Language: English
Resource Type: Journal article