Microbridge testing of silicon nitride thin films deposited on silicon wafers

Journal article

Peer reviewed

T.-Y Zhang, Y.-J SU, C.-F Qian, M.-H Zhao and L.-Q Chen

Acta materialia, Vol.48(11), pp.2843-2857

30/06/2000

Abstract

Condensed matter: structure, mechanical and thermal properties

Exact sciences and technology

Mechanical and acoustical properties

Physical properties of thin films, nonelectronic

Physics

Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)

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Title: Microbridge testing of silicon nitride thin films deposited on silicon wafers
Creators - without role: T.-Y Zhang - Hong Kong University of Science and Technology
Y.-J SU - Hong Kong University of Science and Technology
C.-F Qian - Hong Kong University of Science and Technology
M.-H Zhao - Hong Kong University of Science and Technology
L.-Q Chen - Hong Kong University of Science and Technology
Publication Details: Acta materialia, Vol.48(11), pp.2843-2857
Publisher: Elsevier Science
Identifiers: 9946074308331
Academic Unit: King Abdullah University of Science & Technology
Language: English
Resource Type: Journal article