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Modeling of the removal mechanism of monocrystalline silicon-based on phase change-dislocation theory and its edge chipping damage during micro-grinding
Journal article   Peer reviewed

Modeling of the removal mechanism of monocrystalline silicon-based on phase change-dislocation theory and its edge chipping damage during micro-grinding

Wei Li, Zhipeng Li, Jun Yang, Yinghui Ren, Yi Jiao, Hussien Hegab and Ahmed Mohamed Mahmoud Ibrahim
Precision engineering, Vol.71, pp.103-118
01/09/2021

Abstract

Engineering Engineering, Manufacturing Engineering, Multidisciplinary Instruments & Instrumentation Nanoscience & Nanotechnology Science & Technology Science & Technology - Other Topics Technology

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