Abstract
The corrosion rate of copper under a single droplet of NaCl has been investigated using electrochemical impedance spectroscopy technique. The changes in contact angle, volume loss and droplet height during the progress of corrosion process will be monitored. Corrosion rates were greatly accelerated as the droplet height decreases as a result of the decrease of the diffusion layer thickness and did not alter significantly for higher droplet height. The values of the contact angle, droplet height increase as the holding time progresses, while the volume loss increases. The decrease in contact angle with holding time is accompanied by a decrease in the wetting properties of the copper surface with time. A mechanism describing the successive stages of the corrosion process within a droplet is suggested.